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EMC Oxidation Under High-Temperature Aging

A. Inamdar, P. Gromala, A. Prisacaru, A. Kabakchiev, Y. Yang, B. Han

Abstract. Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics. Among all of the components of an electronic package, EMC is most exposed to the atmosphere, and thus undergoes aging. During high-temperature operation, EMC is oxidized, which alters its mechanical properties, and thus can affect the reliability of electronic components. This chapter focuses on four key aspects of EMC oxidation – (1) the growth of EMC oxidation layer, (2) the mechanical properties of oxidized EMC, (3) the effect of oxidized EMC on thermomechanical behavior of a molded package, and (4) the effect of EMC oxidation on solder joint reliability. This study utilizes various experimental characterization techniques as well as finite element simulation-based analysis.


EMC Oxidation Under High-Temperature Aging


 

Acknowledgement

ArchitectECA2030 has been accepted for funding within (ECSEL JU) in collaboration with the European Union’s H2020 Framework Programs under grant agreement No 877539.

The project will receive an ECSEL JU funding up to 4 M€ completed with national budgets from national funding authorities in Germany, Netherlands, Czech Republic, Austria and Norway.  

Project Facts

Short Name: ArchitectECA2030

Full Name: Trustable architectures with acceptable residual risk for the electric, connected and automated cars

Duration:  01/07/2020- 30/06/2023

Total Costs: ~ € 13,6 Mio.

Consortium: 20 partners from 8 countries

Coordinator: Infineon Technologies AG

Funding

 

Horizon 2020
Horizon 2020

 

    

National Funding

National Funding

 


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