Posted in Webinars
Load Matrix™ is a flexible and for all technologies adaptable solution which supports product development by combining many years of experience with several important development domains (like statistics, engineering, material science, chemical engineering and computational science) to ensure the best possible product results by using market and end customer usage relevant driving profiles.
Posted in ArchitectECA2030 Conferences
At the beginning of September ArchitectECA2030 will be presented at the 14th Graz Symposium Virtual Vehicle in Austria, organized by project partners: Virtual Vehicle Research GmbH and Graz University of technology.
The Graz Symposium Virtual Vehicle 2021 serves as a platform to discuss recent advances in systems integration and virtual validation and its optimal coexistence with physical testing. The event focuses on methods, tools, data, and processes for virtual validation.
More information about the event and registration
Posted in ArchitectECA2030 Conferences
Don't miss out and register now! Join us online to discover, network, learn and shape ‘Our Digital Future’ at the European Forum for Electronic Components and Systems (EFECS) 2020! The fourth edition of this international event is going to be virtual and unique, taking place on 25-26 November 2020.
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Posted in Papers
Adam Ligocki, Ales Jelinek, Ludek Zalud
Abstract.This paper presents our latest extension of the Brno Urban Dataset (BUD), the Winter Extension (WE). The dataset contains data from commonly used sensors in the automotive industry, like four RGB and single IR cameras, three 3D LiDARs, differential RTK GNSS receiver with heading estimation, the IMU and FMCW radar. Data from all sensors are precisely timestamped for future offline interpretation and data fusion. The most significant gain of the dataset is the focus on the winter conditions in snow-covered environments.
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Posted in Papers
A. Inamdar, P. Gromala, A. Prisacaru, A. Kabakchiev, Y. Yang, B. Han
Abstract. Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics. Among all of the components of an electronic package, EMC is most exposed to the atmosphere, and thus undergoes aging. During high-temperature operation, EMC is oxidized, which alters its mechanical properties, and thus can affect the reliability of electronic components. This chapter focuses on four key aspects of EMC oxidation – (1) the growth of EMC oxidation layer, (2) the mechanical properties of oxidized EMC, (3) the effect of oxidized EMC on thermomechanical behavior of a molded package, and (4) the effect of EMC oxidation on solder joint reliability. This study utilizes various experimental characterization techniques as well as finite element simulation-based analysis.
EMC Oxidation Under High-Temperature Aging
